| Technical Specification | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Product Model | DHI-SSD-E900N128G | DHI-SSD-E900N256G | DHI-SSD-E900N512G | DHI-SSD-E900N1TB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Capacity1 | 128 GB | 256 GB | 512 GB | 1 TB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Form Factor | M.2 2280 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Port | PCIe Gen 3.0 x 4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Net Weight | Max 8 g (0.02 lb) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Product Dimensions2 | 80.0 mm × 23.0 mm × 4.8 mm (3.15″ × 0.91″ × 0.19″) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packaging Dimensions | 140.5 mm × 105.5 mm × 15.5 mm (5.53″ × 4.15″ × 0.61″) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Memory Component | 3D NAND | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Power Consumption2 | 3066 mW (max) 566mW (idle) |
2597 mW (max) 528 mW (idle) |
3521 mW (max) 1188 mW (idle) |
3696 mW (max) 1188 mW (idle) |
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| S.M.A.R.T | Support | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TRIM | Support | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Garbage Collection | Support | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Sequential Read3 | Up to 1250 MB/s | Up to 2000 MB/s | Up to 2000 MB/s | Up to 2000 MB/s | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Sequential Write3 | Up to 650
MB/s |
Up to 1050 MB/s | Up to 1450 MB/s | Up to 1600 MB/s | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 4K Random Read3 | Up to 70000 | Up to 90000 | Up to 160000 | Up to 230000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 4K Random Write3 | Up to 160000 | Up to 190000 | Up to 200000 | Up to 230000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MTBF | 1,500,000 hours | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Operating Temperature | 0°C to +70°C (+32°F to +158°F) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Storage Temperature | –40°C to +85°C (–40°F to +185°F) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Operating Humidity | 5%–95% (non-condensing) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Vibration Resistance | 10–200 Hz, 0.5 G | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Shock Resistance | 1500 G/0.5 ms (half sine wave) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TBW | 80TB | 128 TB | 256 TB | 512 TB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Warranty4 | 3-year limited warranty | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Reference Information |
1. Capacity calculation: 1 GB = 1 billion bytes (IDEMA). Actual available capacity might be reduced (due to formatting, partition, operating system applications, or other necessary usage). 2. The dimensions are after installing cooling plate. 3. System configuration of performance test: Intel Z390 Chipset, Intel Core i9-9900KF@3.6GHz, 16GB DDR4,; operating system-Windows 10 x64; testing tool-CrystalDiskMark 6.0.0. 4. Warranty period or maximum write amount (TBW), whichever comes first. 5. High performance SLC cache has been enabled. *Above data based on internal testing of Dahua Memory Laboratory |
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SSD-E900N128G
NVMe M.2 Solid State Drive
> Adopts high-quality 3D NAND wafer level chip
> Supports PCIe3.0 x4, and NVMe 1.3 protocol
> All-metal cooling plate is included; equipped with intelligent temperature control technology
> Supports TRIM to improve read/write performance and speed
> Supports Max. Write technology for full-disk SLC cache
> Supports LDPC ECC
> Low power consumption management
> Supports PCIe3.0 x4, and NVMe 1.3 protocol
> All-metal cooling plate is included; equipped with intelligent temperature control technology
> Supports TRIM to improve read/write performance and speed
> Supports Max. Write technology for full-disk SLC cache
> Supports LDPC ECC
> Low power consumption management
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مراجعة العملاء
منتجات ذات صلة
SSD-C900VN512G
NVMe M.2 Solid State Drive
> Adopts high-quality 3D NAND wafer level chip
> Supports PCIe3.0 x4 and NVMe 1.3 protocol
> All-metal cooling plate is included; equipped with intelligent temperature control technology
> Adopts TRIM to improve read/write performance and speed
> Supports Max. Write technology for full-disk SLC cache
> Supports LDPC ECC to enhance data reliability
> Low power consumption management
SSD-E900N1TB
NVMe M.2 Solid State Drive
> Adopts high-quality 3D NAND wafer level chip
> Supports PCIe3.0 x4, and NVMe 1.3 protocol
> All-metal cooling plate is included; equipped with intelligent temperature control technology
> Supports TRIM to improve read/write performance and speed
> Supports Max. Write technology for full-disk SLC cache
> Supports LDPC ECC
> Low power consumption management
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